Display device

ABSTRACT

A display device, includes: a display unit that includes a first substrate, a second substrate facing the first substrate, and a sealant combining the first and second substrates with each other, the first substrate including an active area that displays an image and a peripheral area adjacent to the active area; and an input detection unit on the second substrate, wherein the input detection unit includes: a sensing electrode on the second substrate and corresponding to the active area; a sensing pad section on the second substrate and corresponding to the peripheral area, the sensing pad section including a plurality of sensing pads electrically connected to the sensing electrode; and a pattern section on the second substrate and corresponding to the peripheral area, the pattern section overlapping the sealant and including a plurality of conductive patterns in a floating state.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to and the benefit of Korean PatentApplication No. 10-2019-0165455 filed on Dec. 12, 2019 in the KoreanIntellectual Property Office, the disclosure of which is herebyincorporated by reference in its entirety.

BACKGROUND

Aspects of some example embodiments of the present invention relate to adisplay device with relatively improved line failure.

A touch screen panel is an input tool that allows a user to use the handor object to input commands by selecting an instruction content (e.g., agraphical depiction of a button, text field, etc.) on a screen of animage display device.

For this, the image display device is provided on its front surface withthe touch screen panel to covert a contact location in direct contactwith the user's hand or object into electrical signals. Therefore, theinstruction content selected at the contact location is accepted as aninput signal.

Because the touch screen panel may replace an input tool, such askeyboard and mouse, which operates while being connected to the imagedisplay device, the use of touch screen panels is gradually expanding.

The touch screen panel is generally attached to an outer surface of aflat display device, such as liquid crystal display device and organicelectroluminescence display device, and thus the overall thickness of aproduct may increase when the product is fabricated to include the touchscreen panel and the flat display device that are formed separately fromeach other.

The above information disclosed in this Background section is only forenhancement of understanding of the background and therefore theinformation discussed in this Background section does not necessarilyconstitute prior art.

SUMMARY

Aspects of some example embodiments of the present invention include adisplay device including an input detection unit that may be capable ofimproving line defects on a display panel.

According to some example embodiments of the present invention, adisplay device may include: a display unit that includes a firstsubstrate, a second substrate that faces the first substrate, and asealant that combines the first and second substrates with each other,the first substrate including an active area that displays an image anda peripheral area adjacent to the active area; and an input detectionunit on the second substrate. The input detection unit may include: asensing electrode that is on the second substrate and corresponds to theactive area; a sensing pad section that is on the second substrate andcorresponds to the peripheral area, the sensing pad section including aplurality of sensing pads electrically connected to the sensingelectrode; and a pattern section that is on the second substrate andcorresponds to the peripheral area, the pattern section overlapping thesealant and including a plurality of conductive patterns in a floatingstate.

According to some example embodiments, the first substrate may furtherinclude: a pixel that corresponds to the active area; a first power linethat supplies the pixel with a first power voltage; and a second powerline that supplies the pixel with a second power voltage.

According to some example embodiments, the pattern section may partiallyoverlap the first power line, the second power line, and the sealant.

According to some example embodiments, the first substrate may furtherinclude an organic layer including an opening that partially exposes thefirst and second power lines. The opening may overlap the sealant.

According to some example embodiments, the first substrate may furtherinclude a signal line connected to the pixel. The signal line may be ona different layer than the first and second power lines. The patternsection may partially overlap the first power line, the second powerline, the sealant, and the signal line.

According to some example embodiments, each of the conductive patternsmay include: a transparent conductive pattern that includes atransparent conductive material; and a metal pattern that includes ametallic material.

According to some example embodiments, the pattern section may bedivided into a plurality of pattern regions that correspond tocorresponding conductive patterns. Each of the pattern regions mayinclude: an effective pattern region where a corresponding conductivepattern is located; and an ineffective pattern region where theconductive pattern is not located.

According to some example embodiments, an area of the effective patternregion may be greater than an area of the ineffective pattern region.

According to some example embodiments, the effective pattern region mayinclude: a first effective pattern region where the transparentconductive pattern is located; and a second effective pattern regionwhere the metal pattern is located. The first effective pattern regionmay overlap the second effective pattern region.

According to some example embodiments, the first effective patternregion may have an area greater than an area of the second effectivepattern region.

According to some example embodiments, on a location where the patternsection and the sealant overlap each other, an area ratio of the secondeffective pattern region to the pattern region may have a value that ischanged based on a first interval that is defined to refer to a distancebetween an end of the second power line and a center of the sealant.

According to some example embodiments, the conductive patterns may bearranged in a first direction and a second direction perpendicular tothe first direction. The conductive patterns may be formed in a zigzagpattern in one or more of the first and second directions.

According to some example embodiments, the input detection unit mayfurther include: a first insulating layer that covers the metal pattern;and a second insulating layer that covers the transparent conductivepattern. The metal pattern may be on the second substrate. Thetransparent conductive pattern may be on the first insulating layer.

According to some example embodiments, each of the conductive patternsmay include a metal pattern including a metallic material.

According to some example embodiments, the pattern section may bedivided into a plurality of pattern regions that correspond tocorresponding conductive patterns. Each of the pattern regions mayinclude: an effective pattern region where the metal pattern is formed;and an ineffective pattern region where the metal pattern is not formed.

According to some example embodiments, the effective pattern region mayhave an area less than an area of the ineffective pattern region.

According to some example embodiments, the conductive patterns may bearranged in a first direction and a second direction perpendicular tothe first direction. The conductive patterns may be formed in a zigzagpattern in one or more of the first and second directions.

According to some example embodiments, on the peripheral area, the firstand second power lines may partially overlap the sealant.

According to some example embodiments, the input detection unit mayfurther include an electrostatic shield section between the sensingelectrode and the pattern section.

According to some example embodiments, the electrostatic shield sectionmay include an electrostatic shield pattern including a metallicmaterial. The electrostatic shield pattern may not overlap the sealant.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A illustrates an assembled perspective view showing a displaydevice according to some example embodiments of the present invention.

FIG. 1B illustrates an exploded perspective view showing a displaydevice according to some example embodiments of the present invention.

FIG. 2 illustrates a simplified cross-sectional view showing a displaymodule according to some example embodiments of the present invention.

FIG. 3 illustrates a plan view showing a display unit according to someexample embodiments of the present invention.

FIG. 4 illustrates a plan view showing an input detection unit accordingto some example embodiments of the present invention.

FIG. 5 illustrates an enlarged view showing a section A1 of FIG. 4.

FIG. 6 illustrates a cross-sectional view taken along the line I-I′ ofFIG. 5.

FIG. 7A illustrates an enlarged view showing a section A2 of FIG. 5.

FIG. 7B illustrates an enlarged view showing the section A2 according tosome example embodiments of the present invention.

FIG. 7C illustrates an enlarged view showing the section A2 according tosome example embodiments of the present invention.

FIG. 7D illustrates an enlarged view showing the section A2 according tosome example embodiments of the present invention.

FIG. 8 illustrates an enlarged view showing the section A1 according tosome example embodiments of the present invention.

FIG. 9A illustrates an enlarged view showing a section A3 of FIG. 8.

FIG. 9B illustrates an enlarged view showing the section A3 according tosome example embodiments of the present invention.

FIG. 10 illustrates a plan view showing an input detection unitaccording to some example embodiments of the present invention.

FIG. 11 illustrates an enlarged view showing a section B1 of FIG. 10.

FIG. 12 illustrates an enlarged view showing a section B2 of FIG. 11.

DETAILED DESCRIPTION

In this disclosure, when a certain component (or region, layer, portion,etc.) is referred to as being “on”, “connected to”, or “coupled to”other component(s), the certain component may be directly formed on,directly connected to, or directly coupled to the other component(s) orat least one intervening component may be present therebetween.

Like numerals indicate like components. Moreover, in the drawings,thicknesses, ratios, and dimensions of components are exaggerated foreffectively explaining the technical contents.

The term “and/or” includes one or more combinations defined byassociated components.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various components, these components shouldnot be limited by these terms. These terms are only used to distinguishone component from another component. For example, a first componentcould be termed a second component, and vice versa without departingfrom the scope of the present invention. Unless the context clearlyindicates otherwise, the singular forms are intended to include theplural forms as well.

In addition, the terms “beneath”, “lower”, “above”, “upper”, and thelike are used herein to describe one component's relationship to othercomponent(s) illustrated in the drawings. The relative terms areintended to encompass different orientations in addition to theorientation depicted in the drawings.

Unless otherwise defined, all terms used herein including technical andscientific terms have the same meaning generally understood by one ofordinary skilled in the art. Also, terms as defined in dictionariesgenerally used should be understood as having meaning identical ormeaning contextually defined in the art and should not be understood asideally or excessively formal meaning unless definitely defined herein.

It should be understood that the terms “comprise”, “include”, “have”,and the like are used to specify the presence of stated features,integers, steps, operations, components, elements, or combinationsthereof, but do not preclude the presence or addition of one or moreother features, integers, steps, operations, components, elements, orcombinations thereof.

The following will now describe aspects of some example embodiments ofthe present invention in conjunction with the accompanying drawings.

FIG. 1A illustrates an assembled perspective view showing a displaydevice according to some example embodiments of the present invention.FIG. 1B illustrates an exploded perspective view showing a displaydevice according to some example embodiments of the present invention.FIG. 2 illustrates a simplified cross-sectional view showing a displaymodule according to some example embodiments of the present invention.

Referring to FIGS. 1A and 1B, a display device DD may be an apparatusthat is activated by an electrical signal. The display device DD mayinclude various embodiments. For example, the display device DD may beused for large-sized electronic apparatuses, such as televisions,monitors, or outdoor billboards, and may also be used for small- andmedium-sized electronic apparatuses, such as personal computers, laptopcomputers, personal digital terminals, automotive navigation units, gameconsoles, portable electronic devices, or cameras. However, these itemsare disclosed only an embodiment, and the display device DD may be usedfor any suitable electronic apparatus that is consistent with the scopeand spirit of the present invention. In some embodiments, a smart-phoneis illustrated as an example of the display device DD, but embodimentsaccording to the present invention are not limited thereto, and thedisplay device DD may be used for any suitable electronic device orapparatus.

The display device DD may display an image IM in a third direction DR3on a display surface IS parallel to each of first and second directionsDR1 and DR2. The image IM may include not only dynamic (e.g., video)images but also static (e.g., still) images. FIG. 1A shows a clockwindow and icons as an example of the image IM. The display surface ISwhere the image IM is displayed may correspond to a front surface of thedisplay device DD and to a front surface of a window WM.

According to some example embodiments, front and rear surfaces (or topand bottom surfaces) of each component are defined based on a directionalong which the image IM is displayed. The front and rear surfaces maybe opposite to each other in the third direction DR3, and a normaldirection to each of the front and rear surfaces may be parallel to thethird direction DR3. Directions indicated by the first, second, andthird directions DR1, DR2, and DR3 are relative concepts and changedinto other directions. In this disclosure, the description “when viewedon a plane” may mean “when viewed in the third direction DR3”

The display device DD may detect an external input TC that is appliedfrom the outside. The external input TC may include any suitable typesof input applied from outside the display device DD. The external inputTC may be provided in various types.

For example, the external input TC may not only include touch of auser's hand or other body part, but include any input (e.g., hoveringtouch) that approaches or is in the vicinity of the display device DD.In addition, the external input TC may include force, pressure, light,or any of other external inputs (e.g., a stylus).

The front surface of the display device DD may be divided into atransmission area TA and a bezel area BZA. The transmission area TA maybe a region where the image IM is displayed. A user may recognize theimage IM through the transmission area TA.

The bezel area BZA may be adjacent to the transmission area TA. Thebezel area BZA may have a certain color. The bezel area BZA may surroundthe transmission area TA. Therefore, the transmission area TA may have ashape substantially defined by the bezel area BZA. However, this is anexample, and the bezel area BZA may be located adjacent to only one sideof the transmission area TA or may be omitted. An electronic apparatusaccording to some embodiments of the present invention may includevarious embodiments, without being limited to a particular embodiment.

The display device DD may include a window WM, a display module DM, anda case EDC. In some example embodiments, the window WM and the case EDCmay be combined with each other to constitute an appearance of thedisplay device DD.

The window WM may include an optically transparent insulating material.For example, the window WM may include glass or plastic. The window WMmay have a multi-layered or single-layered structure. For example, thewindow WM may include either a plurality of plastic films that arecoupled to each other through an adhesive or a glass substrate with aplastic film coupled thereto through an adhesive.

As discussed above, the front surface of the window WM may define thedisplay surface IM of the display device DD. The transmission area TAmay be an optically transparent region. For example, the transmissionarea TA may be a region having a visible light transmittance equal to orgreater than about 90%.

The bezel area BZA may be a region whose transmittance of light isrelatively less than that of the transmission area TA. The bezel areaBZA may define the shape of the transmission area TA. The bezel area BZAmay be adjacent to and may surround the transmission area TA.

The bezel area BZA may have a certain color. The bezel area BZA maycover a peripheral area NAA of the display module DM and may inhibit theperipheral area NAA from being externally visible. This, however, isillustrated as an example, and the bezel area BZA may be omitted fromthe window WM according to some example embodiments of the presentinvention.

The display module DM may display the image IM and may detect anexternal input. The display module DM may be divided into an active areaAA and a peripheral area NAA. The active area AA may be a region that isactivated by an electric signal.

In some example embodiments, the active area AA may be a region thatdisplays the image IM and also detects an external input. Thetransmission area TA may overlap at least the active area AA. Forexample, the transmission area TA may entirely or at least partiallyoverlap the active area AA. Accordingly, a user may recognize the imageIM through the transmission area TA or may provide an external inputthrough the transmission area TA. This, however, is illustrated as anexample, and the active area AA may be configured such that a region todisplay the image IM is separated from a region to detect an externalinput, but embodiments according to present invention are not limited toa particular embodiment.

The peripheral area NAA may be a region covered with the bezel area BZA.The peripheral area NAA may be adjacent to the active area AA. Theperipheral area NAA may surround the active area AA. The peripheral areaNAA may include driver lines or driver circuits to drive the active areaAA.

The case EDC may be combined with the window WM. The case EDC and thewindow WM may be coupled to each other to provide a certain internalspace. The display module DM may be accommodated in the internal space.The case EDC may include a material whose strength is relatively large.For example, the case EDC may include glass, plastic, or metal, or mayinclude a plurality of frames and/or plates made of any combination ofglass, plastic, and metal. The case EDC may stably protect, fromexternal impact, components of the display device DD that areaccommodated in the internal space.

According to some example embodiments, the display module DM and thecase EDC may have therebetween a battery module or the like to providepower required for an overall operation of the display device DD.

Referring to FIG. 2, the display module DM may include a display unit DUand an input detection unit TU. The display unit DU may include a basesubstrate BS, a display circuit layer CL, a display element layer ED, anencapsulation substrate ECS, and a sealant SM.

The base substrate BS may include a flexible substrate, for example, aplastic substrate, a glass substrate, a metal substrate, or anorganic/inorganic composite material substrate. According to someexample embodiments of the present invention, the base substrate BS mayinclude at least one plastic film.

The display circuit layer CL may be formed or arranged on the basesubstrate BS. The display circuit layer CL may include at least oneinsulating layer and a circuit element. The insulating layer may includeat least one inorganic layer and at least one organic layer. The circuitelement may include a signal line, a pixel driver circuit, or the like.The display circuit layer CL may be formed by formation processes inwhich insulating, semiconductor, and conductive layers are coated ordeposited, and by patterning processes in which photolithography is usedto pattern the insulating, semiconductor, and conductive layers.

The display element layer ED may include an organic light emittingelement, a pixel definition layer, and the like. The display elementlayer ED may be formed or arranged at the active area AA of the displaymodule DM.

The encapsulation substrate ECS may be located opposite to the basesubstrate BS, thereby covering or encapsulating the display elementlayer ED to protect the display element layer ED from externalcontaminants. The sealant SM may be located between the encapsulationsubstrate ECS and the base substrate BS. The sealant SM may be locatedon the peripheral area NAA of the display module DM. The sealant SM maycombine the encapsulation substrate ECS and the base substrate BS witheach other. The sealant SM may be provided in the shape of a closed loopto seal a space between the encapsulation substrate ECS and the basesubstrate BS.

The input detection unit TU may be directly arranged on the display unitDU. According to some example embodiments, the input detection unit TUmay be directly placed on the encapsulation substrate ECS. In thisdisclosure, the description “directly placed” (or “directly formed”,“directly arranged”, “directly mounted” or any similar terminology)excludes the meaning that an adhesive layer is used for attachment, butincludes the meaning of “formed by a continuous process”

The input detection unit TU may include sensing electrodes each of whichincludes sensing patterns and sensing lines. The sensing electrodes andthe sensing lines may each have a single-layered or multi-layeredstructure.

Referring back to FIG. 1B, a driver circuit module DCM may beelectrically connected to the display module DM. The driver circuitmodule DCM may include a main circuit board MB, a first flexible circuitboard FCB1, and a second flexible circuit board FCB2.

The main circuit board MB may include power supply connectors or variousdriver circuits to drive the display module DM. The first flexiblecircuit board FCB1 may be coupled to the main circuit board MB and thedisplay unit DU. The driver circuit module DCM may further include adriver chip D-IC mounted on the first flexible circuit board FCB1. Thedriver chip D-IC may include a pixel driver element, for example, a datadriver circuit. In some example embodiments, the driver chip D-IC may bedirectly mounted on the display unit DU.

The second flexible circuit board FCB2 may be coupled to the maincircuit board MB and the input detection unit TU. FIG. 1B shows astructure where the first and second flexible circuit boards FCB1 andFCB2 are connected to the main circuit board MB, but embodimentsaccording to the present invention are not limited thereto. The drivercircuit module DCM may include two main circuit boards that arecorrespondingly connected to the first and second flexible circuitboards FCB1 and FCB2.

FIG. 3 illustrates a plan view showing a display unit according to someexample embodiments of the present invention.

Referring to FIG. 3, the display unit DU may include a driver circuitGDC, a plurality of signal lines SGL, and a plurality of pixels PX. Thedisplay unit DU may further include a pixel pad section PLD that islocated on the peripheral area NAA and includes pixel pads D-PDconnected to corresponding ones of the plurality of signal lines SGL.

The pixels PX may be located on the active area AA. Each of the pixelsPX may include an organic light emitting element and a pixel drivercircuit connected to the organic light emitting element. The drivercircuit GDC, the signal lines SGL, the pixel pad section PLD, and thepixel driver circuit may be included in the display circuit layer CLillustrated in FIG. 2.

The driver circuit GDC may include a gate driver circuit. The gatedriver circuit GDC may generate a plurality of gate signals, and maysequentially output the gate signals to a plurality of gate lines GLwhich will be discussed in more detail below. The gate driver circuitGDC may further output different control signals to the pixel drivercircuit.

The signal lines SGL may include gate lines GL, data lines DL, a firstpower line PL1, a second power line PL2, and a control signal line CSL.One of the gate lines GL may be connected to a corresponding one of thepixels PX, and one of the data lines DL may be connected to acorresponding one of the pixels PX. The first and second power lines PL1and PL2 may be connected to the pixels PX. The control signal line CSLmay provide the gate driver circuit GDC with control signals. The signallines SGL may overlap the active area AA and the peripheral area NAA.

The pixel pad section PLD may be a location to which the first flexiblecircuit board FCB1 is connected, and the pixel pads D-PD of the pixelpad section PLD may be connected to corresponding pads of the firstflexible circuit board FCB1. Portions of connection lines located on thedisplay circuit layer CL may be exposed by an insulating layer includedin the display circuit layer CL, and the exposed portions may correspondto the pixel pads D-PD.

The pixel pads D-PD may be connected through the signal lines SGL tocorresponding pixels PX. In addition, one of the pixel pads D-PD may beconnected through the control signal line CSL to the gate driver circuitGDC.

The first flexible circuit board FCB1 may be coupled to the pixel padsection PLD of the display unit DU, thereby electrically connecting thedisplay unit DU to the main circuit board (see MB of FIG. 1B). A singlefirst flexible circuit board FCB1 may be provided in some embodiments ofthe present invention, but in other embodiments, a plurality of firstflexible circuit boards FCB1 may be provided coupled to the display unitDU.

The pixel PX may receive a gate signal from the gate line GL and a datasignal from the data line DL. In addition, the pixel PX may receive afirst power voltage from the first power line PL1 and a second powervoltage from the second power line PL2. The pixel PX may include atleast one thin film transistor, a capacitor, and an organic lightemitting element.

FIG. 4 illustrates a plan view showing an input detection unit accordingto some example embodiments of the present invention. FIG. 5 illustratesan enlarged view showing a section A1 of FIG. 4. FIG. 6 illustrates across-sectional view taken along the line I-I′ of FIG. 5.

Referring to FIGS. 2 and 4, the input detection unit TU according tosome example embodiments of the present invention may be directly formedon the display unit DU. For example, the input detection unit TU may bedirectly placed on the encapsulation substrate ECS.

The input detection unit TU may detect the external input (see TC ofFIG. 1A) to obtain information about the position of the external inputTC. The input detection unit TU may include a plurality of first sensingelectrodes TE1, a plurality of second sensing electrodes TE2, aplurality of sensing lines TL1, TL2, and TL3, and a sensing pad sectionTPLD.

The first sensing electrodes TE1 and the second sensing electrodes TE2may be located at the active area AA. The input detection unit TU mayobtain information about the external input TC, based on a variation incapacitance between the first sensing electrodes TE1 and the secondsensing electrodes TE2.

The first sensing electrodes TE1 may extend along the first directionDR1, and may be arranged along the second direction DR2. Each of thefirst sensing electrodes TE1 may include first sensing patterns SP1 andfirst connection patterns BP1.

The first sensing patterns SP1 may be arranged along the first directionDR1. The first sensing patterns SP1 may be arranged to be spaced apartfrom each other. Each of the first sensing patterns SP1 may have arhombic shape. This, however, is merely illustrated as an example, andthe first sensing patterns SP1 may have various shapes, and the shapethereof is not limited to a particular embodiment.

The first connection patterns BP1 may connect the first sensing patternsSP1 to each other that are arranged to be spaced apart from each otheralong the first direction DR1. For example, the first connectionpatterns BP1 may be formed between the first sensing patterns SP,thereby connecting the first sensing patterns SP1 to each other.

The second sensing patterns SP2 may be arranged along the seconddirection DR2. The second sensing patterns SP2 may be arranged to bespaced apart from each other. In addition, the second sensing patternsSP2 may be spaced apart from the first sensing patterns SP1. Each of thesecond sensing patterns SP2 may have a rhombic shape. This, however, ismerely illustrated as an example, and the second sensing patterns SP2may have various shapes, and the shape thereof is not limited to aparticular embodiment.

The second connection patterns BP2 may connect the second sensingpatterns SP2 to each other that are arranged to be spaced apart fromeach other along the second direction DR2. For example, the secondconnection patterns BP2 may be located between the second sensingpatterns SP2, thereby connecting the second sensing patterns SP2 to eachother. The second connection patterns BP2 and the second sensingpatterns SP2 may constitute a single unitary shape.

The sensing lines TL1, TL2, and TL3 may be arranged on the peripheralarea NAA. The sensing lines TL1, TL2, and TL3 may include first sensinglines TL1, second sensing lines TL2, and third sensing lines TL3.

The first sensing lines TL1 may be connected to corresponding firstsensing electrodes TE1. For example, the first sensing lines TL1 may becorrespondingly connected to bottom ones of opposite ends of the firstsensing electrodes TE1, which bottom ends are relatively closer to thesensing pad section TPLD.

The second sensing lines TL2 may be connected to corresponding firstsensing electrodes TE1. For example, the second sensing lines TL2 may becorrespondingly connected to top ones of the opposite ends of the firstsensing electrodes TE1, which top ends face the bottom ends.

The first sensing electrodes TE1 may be connected to corresponding firstsensing lines TL1 and corresponding second sensing lines TL2. Therefore,it may be possible to uniformly maintain sensitivity with respect to thefirst sensing electrodes TE1 whose lengths are relatively greater thanthose of the second sensing electrodes TE2. This, however, is merelyillustrated as an example, and the second sensing lines TL2 may beomitted from the input detection unit TU according to some exampleembodiments of the present invention, but embodiments according to thepresent invention are not limited thereto.

The third sensing lines TL3 may be correspondingly connected to ends ofthe second sensing electrodes TE2. For example, the third sensing linesTL3 may be correspondingly connected to left ones of opposite ends ofthe second sensing electrodes TE2.

The sensing pad section TPLD may be located on the peripheral area NAA.The sensing pad section TPLD may be defined to refer to a location towhich the second flexible circuit board FCB2 is connected. In thisdisclosure, the peripheral area NAA may have a partial region that isdefined as a pad area where the sensing pad section TPLD is located. Thesensing pad section TPLD may include sensing pads T-PD extended fromends of the first to third sensing lines TL1 to TL3. The sensing padsT-PD may be connected through the first to third sensing lines TL1 toTL3 to the first and second sensing electrodes TE1 and TE2.

The sensing pads T-PD of the sensing pad section TPLD may be connectedto corresponding pads of the second flexible circuit board FCB2. Thesecond flexible circuit board FCB2 may be coupled to the sensing padsection TPLD of the input detection unit TU, thereby electricallyconnecting the input detection unit TU to the main circuit board (see MBof FIG. 1B).

The input detection unit TU according to some example embodiments of thepresent invention may further include a pattern section TPCD arranged onthe peripheral area NAA. The pattern section TPCD may be located on theencapsulation substrate ECS, while corresponding to the peripheral areaNAA. The pattern section TPCD may include a plurality of conductivepatterns CP in a floating state. In this disclosure, the description“floating state” may mean that the conductive patterns CP are formed inisland shapes without being electrically connected to other components.The conductive patterns CP may be electrically connected to none of thefirst and second sensing electrodes TE1 and TE2 and the first, second,and third sensing lines TL1, TL2, and TL3.

As shown in FIG. 4, a position of the pattern section TPCD and aposition of the sensing pad section TPLD may be symmetrical to eachother about a central line CTL that passes in the first direction DR1through a center of the input detection unit TU.

Referring to FIGS. 5 and 6, the pattern section TPCD may overlap thefirst and second power lines PL1 and PL2 included in the display unitDU. The first and second power lines PL1 and PL2 may overlap the sealantSM. For example, on a location where the pattern section TPCD islocated, the sealant SM may overlap the second power line PL2.

In some example embodiments, the pattern section TPCD may be arranged topartially overlap the first and second power lines PL1 and PL2 and thesealant SM.

On a location where the pattern section TPCD and the sealant SM overlapeach other, a distance d1 (also referred to as a first interval) betweenan end of the second power line PL2 and a center of the sealant SM mayhave a value within a reference range (e.g., a set or predeterminedreference range). For example, the reference range may be from about 110μm to about 220 μm. In addition, on a location where the pattern sectionTPCD is formed, the first power line PL1 and the second power line PL2may be spaced apart from each other at a second interval d2. The secondinterval d2 may be less than the first interval d1. For example, thesecond interval d2 may be about 50 μm.

The plurality of conductive patterns CP may be arranged along the firstdirection DR1 and the second direction DR2. For example, the pluralityof conductive patterns CP may be arranged in a zigzag fashion in thefirst direction DR1.

Each of the conductive patterns CP may include a transparent conductivepattern TCP that includes a transparent conductive material and a metalpattern MTP that includes a metallic material. The metal pattern MTP maybe positioned on one side of the transparent conductive pattern TCP.

As shown in FIGS. 5 and 6, the metal pattern MTP may be formed on theencapsulation substrate ECS. The metal pattern MTP may include ametallic material, such as aluminum, copper, or molybdenum. The metalpattern MTP and the first, second, and third sensing lines TL1, TL2, andTL3 may be formed simultaneously with each other in the same process.

The input detection unit TU may include a first insulating layer IL1that covers the metal pattern MTP. The first insulating layer IL1 mayinclude an inorganic material. The transparent conductive pattern TCPmay be formed on the first insulating layer IL1. The transparentconductive pattern TCP may include a transparent conductive material,such as indium tin oxide or indium zinc oxide. The transparentconductive pattern TCP and the first and second sensing electrodes TE1and TE2 may be formed simultaneously with each other in the sameprocess. The transparent conductive pattern TCP may be covered with asecond insulating layer IL2.

In some example embodiments, the input detection unit TU may furtherinclude a barrier layer between the encapsulation substrate ECS and themetal pattern MTP, and may also include a protective layer formed on thesecond insulating layer IL2.

The display circuit layer CL of the display unit DU may include a firstintermediate insulating layer 10, a second intermediate insulating layer20, and signal lines (see SGL of FIG. 3). The first intermediateinsulating layer 10 may be provided thereon with first signal lines GMof the signal lines SGL, which first signal lines GM are formed of gatemetal. The first signal lines GM may include connection lines thatconnect the data line (see DL of FIG. 2) to the pixel pads (see D-PD ofFIG. 3) on the peripheral area NAA, and may also include gate lines GLlocated at the active area AA. The first signal lines GM may partiallyoverlap the first and second power lines PL1 and PL2.

The first signal lines GM may be covered with the second intermediateinsulating layer 20. The second intermediate insulating layer 20 may beprovided thereon with second signal lines formed of source/drain metal.The second signal lines may include the first and second power lines PL1and PL2.

An organic layer 30 may be located on the display circuit layer CL. Theorganic layer 30 may be either a pixel definition layer of the displayelement layer ED or an encapsulation layer that covers the displayelement layer ED. The organic layer 30 may have an opening OP that isformed along the sealant SM. The opening OP of the organic layer 30 maypartially expose the first and second power lines PL1 and PL2. Theopening OP of the organic layer 30 may overlap the pattern section TPCD.

The sealant SM may be formed between the encapsulation substrate ECS andthe base substrate BS. For example, the sealant SM may be arranged tocorrespond to the opening OP. The sealant SM may be provided in the formof molten frit including glass powder. When the sealant SM is formedbetween the encapsulation substrate ECS and the base substrate BS, alaser La may be irradiated to the sealant SM. A portion of the sealantSM may be melted due to energy of the laser La, and therefore thesealant SM and the encapsulation substrate ECS may be joined with eachother.

The laser La irradiated from the outside may pass through the inputdetection unit TU and then may be supplied to the sealant SM. Forexample, on a location where the pattern section TPCD is formed, thelaser La may be supplied to the sealant SM after passing through thetransparent conductive pattern TCP, or may be reflected from the metalpattern MTP. Therefore, a transmittance of the laser La may be less at alocation where the pattern section TPCD is located than at a locationwhere the pattern section TPCD is not located.

The transmittance of the laser La at the location where the patternsection TPCD is located may decrease within a range in which there is noreduction in cohesive force between the sealant SM and the encapsulationsubstrate ECS. In the case where the pattern section TPCD causes thereduction in transmittance of the laser La, it may be possible toprevent or reduce defects such as short-circuit occurring when somelines (e.g., the first and second power lines PL1 and PL2) in thedisplay unit DU are melted and connected due to heat generated from thelaser La.

Moreover, because the opening OP of the organic layer 30 is formed alongthe sealant SM, gas discharge from the organic layer 30 due to heatproduced in the laser irradiation process may be prevented or reduced.For example, because the pattern section TPCD is formed on a locationwhere the sealant SM overlaps the first and second power lines PL1 andPL2 that are exposed to the opening OP of the organic layer 30, it maybe possible to avoid defects in which the first and second power linesPL1 and PL2 are short-circuited due to heat caused by the laser La.

FIG. 7A illustrates an enlarged view showing a section A2 of FIG. 5.FIG. 7B illustrates an enlarged view showing the section A2 according tosome example embodiments of the present invention. FIG. 7C illustratesan enlarged view showing the section A2 according to some exampleembodiments of the present invention. FIG. 7D illustrates an enlargedview showing the section A2 according to some example embodiments of thepresent invention.

Referring to FIGS. 5 and 7A to 7D, the pattern section TPCD may bedivided into pattern regions PA that correspond to the conductivepatterns CP, respectively. Each of the pattern regions PA may include aneffective pattern region APA and an ineffective pattern region NAPA. Theeffective pattern region APA may be defined to refer to a region where acorresponding conductive pattern CP is located, and on each patternregion PA, the ineffective pattern region NAPA may be defined to referto a residual region where the corresponding conductive pattern CP isnot located. In some example embodiments, the effective pattern regionAPA may have an area greater than that of the ineffective pattern regionNAPA.

The effective pattern region APA may include a first effective patternregion APA1 and a second effective pattern region APA2. The firsteffective pattern region APA1 may be defined to refer to a region wherethe transparent conductive pattern TCP is located, and the secondeffective pattern region APA2 may be defined to refer to a region wherethe metal pattern MTP is located. In some example embodiments, the firsteffective pattern region APA1 may have an area greater than that of thesecond effective pattern region APA2.

The conductive patterns CP may be arranged in the first and seconddirections DR1 and DR2. The conductive patterns CP may be arranged in azigzag fashion in the first direction DR1. The transparent conductivepattern TCP may have a tetragonal shape. Embodiments according to thepresent invention, however, are not limited thereto. For example, thetransparent conductive pattern TCP may have a polygonal shape, acircular shape, or any other shape. In some example embodiments, asshown in FIG. 7A, the transparent conductive pattern TCP may have arectangular shape elongated in the second direction DR2. The transparentconductive pattern TCP may have a vertical width W1 (also referred to asa first width) in the first direction DR1 and a horizontal width W2(also referred to as a second width) in the second direction DR2, andthe first width W1 may be less than the second width W2. In some exampleembodiments, the first width W1 may be about 36 μm, and the second widthW2 may be about 40 μm.

The metal pattern MTP may overlap one side of the transparent conductivepattern TCP. FIG. 7A shows a structure where the metal pattern MTP ispositioned adjacent to a right side of the transparent conductivepattern TCP, but the position of the metal pattern MTP is not limitedthereto. For example, as shown in FIG. 7B or 7C, the metal pattern MTPmay be positioned on a central portion of the transparent conductivepattern TCP.

In some example embodiments, the metal pattern MTP may have a tetragonalshape. The shape of the metal pattern MTP, however, is not limitedthereto. For example, the metal pattern MTP may have a polygonal shape,a circular shape, or any other shape. In some example embodiments, asshown in FIG. 7A, the metal pattern MTP may have a rectangular shapeelongated in the first direction DR1. The metal pattern MTP may have avertical width W3 (also referred to as a third width) in the firstdirection DR1 and a horizontal width W4 (also referred to as a fourthwidth) in the second direction DR2, and the third width W3 may begreater than the fourth width W4. In some example embodiments, the thirdwidth W3 may be about 20 μm, and the fourth width W4 may be about 6 μm.

The transparent conductive pattern TCP may be arranged to be spacedapart from other transparent conductive pattern TCP on an adjacentpattern region PA. For example, two transparent conductive patterns TCPadjacent in the second direction DR2 may be arranged to be spaced apartfrom each other, and two transparent conductive patterns TCP adjacent inthe first direction DR1 may be arranged to be spaced apart from eachother. The ineffective pattern region NAPA may include a location wheretwo transparent conductive patterns TCP are formed to be spaced apartfrom each other in the second direction DR2, and may also include alocation where two transparent conductive patterns TCP are formed to bespaced apart from each other in the first direction DR1. The ineffectivepattern region NAPA may have a fifth width W5 in the second directionDR2 and a sixth width W6 in the first direction DR1. The fifth and sixthwidths W5 and W6 may be the same as or different from each other.

In some example embodiments, as shown in FIG. 7C, the metal pattern MTPmay have a rectangular shape elongated in the second direction DR2. Themetal pattern MTP may be located on a central portion of the transparentconductive pattern TCP.

As shown in FIGS. 5 and 7D, the transparent conductive patterns TCP maybe arranged to be aligned with each other in the first and seconddirections DR1 and DR2. The metal patterns MTP may be arranged tooverlap the transparent conductive patterns TCP. The metal patterns MTPmay be arranged in a zigzag fashion in the first direction DR1. Forexample, on a first row, the metal patterns MTP may be arranged adjacentto corresponding left sides of the transparent conductive patterns TCP.On a second row, the metal patterns MTP may be arranged adjacent tocorresponding right sides of the transparent conductive patterns TCP.

In some example embodiments, an area ratio of the second effectivepattern region APA2 to the pattern region PA may range from about 5% toabout 10%. The area ratio of the second effective pattern region APA2may have a value that is changed based on a distance (e.g., the firstinterval d1 of FIG) between the end of the second power line PL2 and thecenter of the sealant SM. In some embodiments, the smaller the firstinterval d1, the larger the area ratio of the second effective patternregion APA2, and the larger the first interval d1, the smaller the arearatio of the second effective pattern region APA2. For example, when thefirst interval d1 is about 117 μm, the area ratio of the secondeffective pattern region APA2 may be set to about 7%. For anotherexample, when the first interval d1 is about 167 μm, the area ratio ofthe second effective pattern region APA2 may be set to about 6%. Foranother example, when the first interval d1 is about 217 μm, the arearatio of the second effective pattern region APA2 may be set to about5%. The area ratio and the first interval d1 are not limited to thevalues mentioned above.

The larger the area ratio of the second effective pattern region APA2,the lower the transmittance of the laser (see La of FIG. 6) at thepattern section TPCD, which may result in a reduction in meltingefficiency of the sealant SM arranged below the pattern section TPCD.The reduction in melting efficiency of the sealant SM may decrease thecohesive force between the sealant SM and the encapsulation substrateECS. Therefore, according to some example embodiments, the area ratio ofthe second effective pattern region APA2 may be set to control thetransmittance of the laser La within a range in which there is noreduction in cohesive force between the sealant SM and the encapsulationsubstrate ECS.

In addition, because the metal patterns MTP for the reflection of thelaser La are formed in a zigzag fashion or pattern, a laser reflectioneffect may be uniformly obtained on the entirety of the pattern sectionTPCD. Therefore, the laser reflection effect may be concentrated only ona specific region, with the result that, on the specific region, it maybe possible to prevent the reduction in cohesive force between thesealant SM and the encapsulation substrate ECS.

FIG. 8 illustrates an enlarged view showing the section A1 according tosome example embodiments of the present invention. FIG. 9A illustratesan enlarged view showing a section A3 of FIG. 8. FIG. 9B illustrates anenlarged view showing the section A3 according to some exampleembodiments of the present invention. In the embodiment shown in FIG. 8,the same components as those illustrated in FIG. 5 are allocated thesame reference symbols, and detailed descriptions thereof will beomitted.

Referring to FIGS. 8 to 9B, the pattern section TPCD may include theconductive patterns CP. The conductive patterns CP may be the metalpatterns MTP formed of a metallic material. The pattern section TPCD maybe divided into a plurality of pattern regions PA. Each of the patternregions PA may include an effective pattern region APA and anineffective pattern region NAPA. The effective pattern region APA may bedefined to refer to a region where a corresponding metal pattern MTP islocated, and on each pattern region PA, the ineffective pattern regionNAPA may be defined to refer to a residual region where the metalpattern MTP is not located. The effective pattern region APA may have anarea less than that of the ineffective pattern region NAPA. In someexample embodiments, an area ratio of the effective pattern region APAto the pattern region PA may be set to about 9.6%.

The metal patterns MTP may be arranged in the first and seconddirections DR1 and DR2. In some example embodiments, the metal patternsMTP may be arranged in a zigzag fashion in the first direction DR1.Embodiments according to the present invention, however, are not limitedthereto. For example, the metal patterns MTP may arranged in a zigzagfashion in both the first and second directions DR1 and DR2.

In some example embodiments, the metal pattern MTP may have a tetragonalshape. The shape of the metal pattern MTP, however, is not limitedthereto. For example, the metal pattern MTP may have a polygonal shape,a circular shape, or any other shape. In some example embodiments, asshown in FIG. 9A, the metal pattern MTP may have a rectangular shapeelongated in the first direction DR1.

The metal pattern MTP may be arranged adjacent to one side of thepattern region PA. FIG. 9A shows a structure where the metal pattern MTPis positioned adjacent to a right side of the pattern region PA, but theposition of the metal pattern MTP is not limited thereto. For example,the metal pattern MTP may be located at a central portion of the patternregion PA.

In some embodiments, as shown in FIG. 9B, the metal pattern MTP may havea rectangular shape elongated in the second direction DR2. The metalpattern MTP may be positioned on a central portion of the pattern regionPA, and the metal patterns MTP may be arranged in a zigzag fashion inthe first direction DR1.

FIG. 10 illustrates a plan view showing an input detection unitaccording to some example embodiments of the present invention. FIG. 11illustrates an enlarged view showing section B1 of FIG. 10. FIG. 12illustrates an enlarged view showing section B2 of FIG. 11.

Referring to FIGS. 10 to 12, the input detection unit TU according tosome example embodiments of the present invention may further include anelectrostatic shield section SPP arranged at the peripheral area NAA.The electrostatic shield section SPP may be located between the patternsection TPCD and the first and second sensing electrodes TE1 and TE2.The electrostatic shield section SPP may prevent or reduce the first andsecond sensing electrodes TE1 and TE2 from receiving electrostaticcharges that can be externally introduced through the pattern sectionTPCD.

The electrostatic shield section SPP may include a plurality ofelectrostatic shield patterns SMTP located between the conductivepattern CP and the first and second sensing electrodes TE1 and TE2.

Each of the plurality of electrostatic shield patterns SMTP may includea metallic material. Therefore, the plurality of electrostatic shieldpatterns SMTP may be located on the same layer (e.g., the encapsulationsubstrate ECS of FIG. 6) on which the metal pattern MTP is located. Theplurality of electrostatic shield patterns SMTP and the metal patternMTP may be formed simultaneously with each other in the same process.

The electrostatic shield patterns SMTP may be located on theencapsulation substrate ECS, while corresponding to the peripheral areaNAA. The electrostatic shield patterns SMTP may have a floating state.In this disclosure, the description “floating state” may mean that theelectrostatic shield patterns SMTP are formed in island shapes withoutbeing electrically connected to other members.

As shown in FIG. 11, the electrostatic shield patterns SMTP may bearranged at a location that does not overlap the sealant SM. When theelectrostatic shield patterns SMTP are arranged at a location thatoverlaps the sealant SM, the electrostatic shield patterns SMTP maydecrease the transmittance of the laser (see La of FIG. 6). Accordingly,because the electrostatic shield patterns SMTP do not overlap thesealant SM, an electrostatic shield effect may be achieved withoutaffecting the cohesive force between the sealant SM and theencapsulation substrate ECS.

Referring to FIGS. 11 and 12, the electrostatic shield patterns SMTP maybe arranged in the first and second directions DR1 and DR2. Theelectrostatic shield patterns SMTP may be arranged in a zigzag fashionor pattern in the first direction DR1. Each of the electrostatic shieldpatterns SMTP may have a tetragonal shape. Embodiments according to thepresent invention, however, are not limited thereto. For example, theelectrostatic shield patterns SMTP may each have a polygonal shape, acircular shape, or any other shape. In some example embodiments, theelectrostatic shield patterns SMTP may each have a rectangular shapeelongated in the second direction DR2. The electrostatic shield patternsSMTP may each have a vertical width t1 (also referred to as a firstwidth) in the first direction DR1 and a horizontal width L1 (alsoreferred to as a second width) in the second direction DR2, and thefirst width t1 may be less than the second width L1. In some exampleembodiments, the first width t1 may be about 7 μm, and the second widthL1 may be about 30 μm.

The electrostatic shield patterns SMTP may be arranged to be spacedapart from each other in the first and second directions DR1 and DR2.For example, two electrostatic shield patterns SMTP adjacent in thesecond direction DR2 may be spaced apart from each other at a thirdinterval d3, and two electrostatic shield patterns SMTP adjacent in thefirst direction DR1 may be spaced apart from each other at a fourthinterval d4. The third interval d3 and the fourth interval d4 may be thesame as or different from each other. In some example embodiments, theelectrostatic shield section SPP may have a total width t2 of about 29μm in the first direction DR1.

In a display device according to some example embodiments of the presentinvention, an input detection unit may include a pattern section thatcorresponds to a location where a sealant overlaps first and secondpower lines of a display unit. In a laser irradiation process formelting the sealant, the pattern section may reduce a lasertransmittance within a range in which there is no reduction cohesiveforce between the sealant and an encapsulation substrate.

Accordingly, it may be possible to prevent or reduce defects such asshort-circuit occurring when some lines in the display unit are meltedand connected due to heat generated from the laser.

Although the example embodiments have been described with reference to anumber of illustrative examples thereof, it will be understood by thoseof ordinary skill in the art that various changes in form and detailsmay be made without departing from the spirit and scope of the presentinvention as set forth in the following claims and their equivalents.Thus, the technical scope of the present invention is not limited by theembodiments and examples described above, but by the following claimsand their equivalents.

What is claimed is:
 1. A display device, comprising: a display unit thatincludes a first substrate, a second substrate facing the firstsubstrate, and a sealant combining the first and second substrates witheach other, the first substrate including an active area that displaysan image and a peripheral area adjacent to the active area; and an inputdetection unit on the second substrate, wherein the input detection unitincludes: a sensing electrode on the second substrate and correspondingto the active area; a sensing pad section on the second substrate andcorresponding to the peripheral area, the sensing pad section includinga plurality of sensing pads electrically connected to the sensingelectrode; and a pattern section on the second substrate andcorresponding to the peripheral area, the pattern section overlappingthe sealant and including a plurality of conductive patterns in afloating state.
 2. The display device of claim 1, wherein the firstsubstrate further includes: a pixel corresponding to the active area; afirst power line configured to supply the pixel with a first powervoltage; and a second power line configured to supply the pixel with asecond power voltage.
 3. The display device of claim 2, wherein thepattern section partially overlaps the first power line, the secondpower line, and the sealant.
 4. The display device of claim 2, whereinthe first substrate further includes an organic layer including anopening that partially exposes the first and second power lines, whereinthe opening overlaps the sealant.
 5. The display device of claim 2,wherein the first substrate further includes a signal line connected tothe pixel, wherein the signal line is on a different layer than thefirst and second power lines, and wherein the pattern section partiallyoverlaps the first power line, the second power line, the sealant, andthe signal line.
 6. The display device of claim 2, wherein each of theconductive patterns includes: a transparent conductive pattern includinga transparent conductive material; and a metal pattern including ametallic material.
 7. The display device of claim 6, wherein the patternsection is divided into a plurality of pattern regions that correspondto corresponding conductive patterns, wherein each of the patternregions includes: an effective pattern region where a correspondingconductive pattern is located; and an ineffective pattern region wherethe conductive pattern is not located.
 8. The display device of claim 7,wherein an area of the effective pattern region is greater than an areaof the ineffective pattern region.
 9. The display device of claim 8,wherein the effective pattern region includes: a first effective patternregion where the transparent conductive pattern is located; and a secondeffective pattern region where the metal pattern is located, wherein thefirst effective pattern region overlaps the second effective patternregion.
 10. The display device of claim 9, wherein the first effectivepattern region has an area greater than an area of the second effectivepattern region.
 11. The display device of claim 9, wherein on a locationwhere the pattern section and the sealant overlap each other, an arearatio of the second effective pattern region to the pattern region has avalue that is changed based on a first interval that is defined to referto a distance between an end of the second power line and a center ofthe sealant.
 12. The display device of claim 6, wherein the conductivepatterns are arranged in a first direction and a second directionperpendicular to the first direction, and the conductive patterns areformed in a zigzag pattern in one or more of the first and seconddirections.
 13. The display device of claim 6, wherein the inputdetection unit further includes: a first insulating layer covering themetal pattern; and a second insulating covering the transparentconductive pattern, wherein the metal pattern is on the secondsubstrate, and wherein the transparent conductive pattern is on thefirst insulating layer.
 14. The display device of claim 2, wherein eachof the conductive patterns includes a metal pattern including a metallicmaterial.
 15. The display device of claim 14, wherein the patternsection is divided into a plurality of pattern regions that correspondto corresponding conductive patterns, wherein each of the patternregions includes: an effective pattern region where the metal pattern islocated; and an ineffective pattern region where the metal pattern isnot located.
 16. The display device of claim 15, wherein the effectivepattern region has an area less than an area of the ineffective patternregion.
 17. The display device of claim 15, wherein the conductivepatterns are arranged in a first direction and a second directionperpendicular to the first direction, and the conductive patterns areformed in a zigzag pattern in one or more of the first and seconddirections.
 18. The display device of claim 2, wherein, in theperipheral area, the first and second power lines partially overlap thesealant.
 19. The display device of claim 1, wherein the input detectionunit further includes an electrostatic shield section between thesensing electrode and the pattern section.
 20. The display device ofclaim 19, wherein the electrostatic shield section includes anelectrostatic shield pattern including a metallic material, wherein theelectrostatic shield pattern does not overlap the sealant.